
Die bonding solutions
MRSI Systems – part of Mycronic Group
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27 1月 2025PRESS RELEASEDIE BONDING SOLUTIONS
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30 9月 2024PRESS RELEASEDIE BONDING SOLUTIONS
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4 9月 2024PRESS RELEASEDIE BONDING SOLUTIONS
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19 3月 2024PRESS RELEASEDIE BONDING SOLUTIONS
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12 3月 2024PRESS RELEASEDIE BONDING SOLUTIONS
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5月6日EventDIE BONDING SOLUTIONS
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6月17日 - 6月19日EventDIE BONDING SOLUTIONS
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6月18日 - 6月21日EventDIE BONDING SOLUTIONS
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9月10日 - 9月12日EventDIE BONDING SOLUTIONS
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9月29日 - 10月1日EventDIE BONDING SOLUTIONS
MRSI Die Bonding, Epoxy Dispensing, and Active Alignment Solutions

High Precision Flip-chip Die Bonders

Active Alignment Solutions
MRSI A-L is a modular–design machine, with integrated pick and place, dispense, vision, alignment functions, as well as intelligent software that offers users flexible processes. It is a powerful tool for optical components assembly, such as transceivers, silicon photonics, AWGs, LiDAR, integrated optics etc.

High Precision Epoxy Dispensers
The next generation MRSI-175Ag Epoxy Dispenser handles the most demanding dispensing applications such as advanced packaging, microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging. With the ability to operate two heads in tandem, the MRSI-175Ag provides unparalleled process control and comprehensive dispensing capability. Die attach, underfill, encapsulation, and multi-pin stamping are all supported on this flexible dispensing platform.

Prototyping & Training Services
MRSI offers a comprehensive set of prototyping and training services. Led by experienced engineers, the programs are tailored to suit each customer’s needs, including concepts of robot orientation, teaching alignments, the die bonding process and production set up.
