Go to main content

贴片
Contact us
Mycronic Global Log in
Upcoming Events Past Events
11月20日 - 11月21日
Online

Automotive LIDAR 2024

7th Annual Conference and Exhibition. MRSI Mycronic will be presenting.
Die bonding
United States of America
English
1月21日, 2025 - 1月23日, 2025
Santa Clara, CA USA

Chiplet Summit 2025

MRSI Mycronic is sponsoring the Chiplet Summit at the Santa Clara Convention Center.
Die bonding
United States of America
English
1月28日, 2025 - 1月30日, 2025
San Francisco, CA USA

SPIE Photonics West 2025

Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and optoelectronics. Booth: #5407
Die bonding
United States of America
English
2月26日, 2025 - 2月28日, 2025
Marina Bay Sands Singapore

Asia Photonics Expo 2025

MRSI Mycronic will exhibit at the Asia Photonics Expo 2025.
Die bonding
Singapore
English
3月3日, 2025 - 3月6日, 2025
Phoeniz, AZ, USA

IMAPS Device Packaging Conference 2025

The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025.
Die bonding
United States of America
English
3月11日, 2025 - 3月13日, 2025
Shanghai New International Expo Centre (SNIEC)

LASER World of PHOTONICS CHINA 2025

Asia’s largest trade fair for the photonics industry in Shanghai New International Expo Centre (SNIEC)
Die bonding
China
Chinese
4月1日, 2025 - 4月3日, 2025
San Francisco, CA USA

OFC 2025

OFC is the world's largest event for optical networking and communications. MRSI Mycronic Booth: #3218
Die bonding
United States of America
English
5月6日, 2025
Boxborough, MA, USA

IMAPS New England 2025

International Microelectronics Assembly and Packaging Society (IMAPS) New England 51st Symposium & Expo.
Die bonding
United States of America
English
6月17日, 2025 - 6月19日, 2025
San Francisco, CA

IMS - International Microwave Symposium 2025

IMS is focused on the microwave industry. MRSI Booth: #1629
Die bonding
United States of America
English
6月18日, 2025 - 6月21日, 2025
Bangkok, Thailand

Nepcon Thailand 2025

MRSI Mycronic will exhibit at Nepcon Thailand 2025.
Die bonding
Singapore
English
9月10日, 2025 - 9月12日, 2025
Shenzhen, China

CIOE – China International Optoelectronic Expo 2025

CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention & Exhibition Center Shenzhen, China.
Die bonding
China
English
9月29日, 2025 - 10月1日, 2025
Copenhagen, Denmark

ECOC 2025

The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #C4315
Die bonding
Denmark
English
10月7日, 2025 - 10月9日, 2025
Phoeniz, AZ USA

SEMICON West 2025

SEMICON West includes the extended microelectronics industry supply chain. Booth: #6268
Die bonding
United States of America
English